Overview

The SNN65-HXP is a silver nickel based grade having excellent shielding effectiveness .

This heat curing version is exhibiting superior adhesion and mechanical strength ensuring hight stability in harsh environment 

Specifications

Additional Product Description
Cure Conditions

Cure Conditions 120?C minimum

Cure Time at 125?C (b) 1.5 hours

Additional Information

(a) Compression-deflection bead size 0.60 mm (H) x 0.70 mm (W)

(b) Time to effectively cure a bead will necessarily depend on individual conditions including bead size shield size and weight oven capacity and oven ramp-rates
Adhesion
AI 200
Applications
Optical transceiver, tablet, scanner
Compression Set
10%
Datasheet ID
EMI-DS-FIP-SNN65-HXP 0510
Density
Density (cured) 3.84
Elastomer
Silicone
Filler
Silver, Nickel
Hardness
65
Industries
DataCom, Military, Medical, Industrial
Product Benefits
Long term reliability
Product Title
SNN65-HXP
Shielding Effectiveness
200 MHz to 10 GHz (MIL-DTL-83528C Mod) > 100 dB
Shore Hardness
65
Temperature - Operating (Max Celsius)
125
Temperature - Operating (Min Celsius)
-50
Temperature Range
-50 to 125C
UL Flammability
V0
UL rating
V0
Volume Resistivity
0.005

Documentation

File Type Last Updated
SNN65-HXP RoHs.pdf Datasheet 11-21-18
SNN65-HXP.pdf Datasheet 11-21-18
EMI-CAT-ECE 080615 web FIP.pdf Documentation 11-21-18
EMI-CAT-Essentials 1213.pdf Documentation 11-21-18