Automotive Component Sector

For two decades, Laird materials science experts have helped Tier 1 and additional automotive suppliers resolve complex design challenges. Disruptive electromagnetic interference. Unwanted heat. Structural. We are designers helping designers avoid wasted effort - and costs - and speeding the time-to-market for key components.

Review our portfolio of protection solutions. Then contact Laird today.

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Putty

Superior Protection From a Global Innovator in Material Science

EV Powertrain Electronics

Our team of engineers applies extensive industry knowledge about sub-assembly design to help safeguard EV powertrain electronics from heat and EMI issues.

Examples include PFC chokes and transformers, which by their nature are not perfectly efficient and generate heat. Each must be housed individually – and thermally potted.

We get behind the wheel to help with two differentiators. First, we are vertically integrated down to the magnetic ceramic powder. Second, as a significant thermal compounds supplier we are again vertically integrated down to the resins and fillers.

These differentiators help give us the green light to assume responsibility for performance and quality assurance across a much larger swath of the supply chain than our competitors.

Green car
1. Low Profile SMD DCDC Power Inductor
  • Lowest cost design goal
  • Maximum shielding
  • Down to 1.88mm part height
  • For space-conscious designs
app
2. TGREASE 2500 Thermally Conductive Grease
  • 3.8 W/mK thermal conductivity
  • Environmentally friendly; silicone free
  • Thoroughly wets out thermal surfaces 
  • No migration issues
tgrease
3. Broadband Wire Mound Common Mode Choke
  • Nanocrystalline core
  • Enables higher switching mode designs
  • High power/high efficiency apps
acp 3
4. TFLEX CR200 Cure-In-Place Gap Filler
  • 2.0 W/mK thermal conductivity 
  • 2-part silicone base
  • Low viscosity 
  • Ideal for large gap tolerances
acp 4

LED Component Systems

Our team of engineers applies extensive industry knowledge about sub-assembly design to help suppress EMI crosstalk from automotive LED systems. And to help better safeguard against excessive heat.

Modern lighting systems are comprised of a power supply, a digital control board, and a light source – all ideally physically separated from each other. The pressure to reduce size frequently results in placing the analog, digital, and optical functions close together and not electrically isolated. This can create electrical crosstalk and can expose the optics to processing chemicals needed for the analog and digital circuits.

Laird has a complete line of non-silicone and low outgassing silicone-based pads, greases and dispensable products. Most importantly, we have the experience to advise you about deploying a variety of strategies. Our multi-functional solutions help cool components and suppress EMI simultaneously - using a single space-saving product.

Yellow car
1. Beam Shading Stamped Metal
  • Beam shading and steering
  • Rapid prototyping
  • Long term performance simulation
  • *NAL patent pending
LED Light
2. TFLEX SF8800 Gap Filler
  • 8.0 W/mK conductivity
  • Superior pressure vs. deflection
  • Low total thermal resistance
  • Excellent surface wetting
TFLLEX
3. TPUTTY 508 Single Part Dispensable Gap Filler
  • 3.7 W/mK thermal conductivity
  • Designed for automation
  • Vertical stability
  • Minimum component stress
  • RoHS compliant
TPUTTY
4. EMI Low Current Magnetic Ceramic Chip Beads
  • Superior noise suppression 
  • Currents up to 10A; low DCR
  • Vibration resistant
  • Small footprint
LED light 2

ADAS / Autonomous Driving Systems

Our team of engineers applies extensive industry knowledge about sub-assembly design to help safeguard ADAS electronic components from EMI and excessive heat.

Progressive ADAS sensor designs consume more power and emit more heat. To remain competitive, manufacturers must ensure optimum sensor efficiency or face the risk of throttled power, in turn sacrificing sensitivity, range and performance.

Electromagnetic interference (EMI) is a barrier to function and compliance. Increasing transistor switching speeds cause various device fundamentals and harmonics to interact with each other, and the outside world, in unanticipated ways.

Blue car
1. Q-ZORB Thermoset Microwave Absorber
  • Nomex™️ or fiberglass honeycomb core
  • Optimize insertion loss
  • Optimize reflection loss
  • For radar/radar brackets
Q-zorb
2. TGREASE 2500
  • 3.8 W/mK thermal conductivity
  • Silicone free thermal grease 
  • Ends migration issues
  • Environmentally friendly
Tgrease 2500
3. TPUTTY 607 One-Part Dispensable Gap Filler
  • 6.4 W/mK thermal conductivity
  • Vertical reliability
  • Low outgassing
  • For PCB apps/lidar 
Tputty 607
4. SSMD Electronic Contact
  • Board/device interconnections
  • Nickel, tin, gold, silver platings
  • 0.13mm thickness
auto prod

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EV/PHEV Battery Packs

Our team of engineers applies extensive industry knowledge about sub-assembly design to help safeguard EV/PHEV battery packs from the consequences of excessive heat.

With increased charging speeds, battery packs emit ever increasing amounts of heat. Are packs actively or passively cooled? Must the thermal material act as a dielectric barrier? Is the pack silicone- or non-silicone mandated? Are the thermal materials themselves relied upon for mechanical support or for high compliance?

Ultimately, the appropriate choice of thermal interface materials satisfies the design constraints while simultaneously satisfying the economics. It comes after extensive evaluation of the total cost of ownership and true cost of implementation in a serial production setting. Huge material volumes are required. The importance of fast placement of preferred materials cannot be overstated.

red car
1. TPUTTY 508 Single Part Dispensable Gap Filler
  • 3.7 W/mK thermal conductivity
  • Designed for automation
  • Vertical stability
  • Minimum component stress
  • RoHS compliant
TPUTTY
2. TFLEX SF600 Thermally Conductive Gap Pad
  • 3.0 W/mK conductivity
  • Silicone-free for sensitive apps
  • 0.25mm to 3.56mm thickness
  • RoHS compliant
Tflex sf600
3. TFLEX CR200 Cure-In-Place Gap Filler
  • 2.0 W/mK thermal conductivity
  • 2-part silicone base
  • Low viscosity 
  • Ideal for large gap tolerances
CFLEX CR200
4. TFLEX 400 HD Thermal Pad 
  • 40 W/mK conductivity 
  • High deflection gap filler
  • 1mm to 4mm thicknesses 
  • Excellent surface wetting
TFLLEX

Infotainment/Cluster Systems

Our team of engineers applies extensive industry knowledge of mechanical, thermal and electronic design to help safeguard infotainment/cluster systems from heat and EMI issues.

Infotainment electronics are employing greater functionality and higher speeds, causing more pronounced EMI and thermal challenges. A passive cooling strategy is imperative to eliminate the fan without relinquishing any gains in the power budget.

Following 20 years of experience in infotainment electronics, Laird has a first-hand perspective on strategies that have succeeded and failed. We consult with our customers comprehensively on ridding systems of unwanted EMI and growing thermal loads, and on helping design teams succeed as they go-to-market.

Orange car
1. Fabric-Over-Foam Gasket
  • Plated, conductive fabrics/foams
  • EMI shielding effectiveness > 100dB
  • Low surface resistivity 
  • RoHS compliant, Halogen free
Fabric-over-foam gasket
2. MGV Power Inductor
  • Lowest cost design goal
  • Magnetic shielded
  • High current/low profile
  • Low DCR/high efficiency 
MGV power inductor
3. EMI Low Current Magnetic Ceramic Chip Bead
  • Superior noise suppression 
  • Currents up to 10A; low DCR
  • Vibration resistant
  • Small footprint
EMI Low Current
4. TPUTTY 607 Single Part Dispensable Gap Filler
  • Low stress on components
  • Designs for low cost
  • Maximum thermal transfer
  • PCB apps
TPUTTY 607 Single Part

We Are Automotive Grade. With Agility for Two Decades.

Laird tests, posits scenarios, models/simulates, refines, hypotheses, iterates and validates. We listen. We question. We synthesize. Put our experience to use.

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