Overview

Thermally Conductive Printed Circuit Board Substrate

Tlam SS 1KA is a thermally conductive printed circuit board (PCB) substrate. The substrate consists of a copper circuit layer bonded to an aluminum or copper base plate with Laird 3 watt/m-K 1KA dielectric. Tlam SS 1KA materials are processed through standard FR4 print and etch operations.

 

Tlam SS 1KA has 8-10 times better thermal conductivity compared to FR4, and this is the key to keeping components cool. The Tlam SS 1KA boards run through standard pick and place SMT and manual wire bond processes.

 

Tlam SS 1KA is designed for applications that require the best thermal performance and resistance to thermal cycling. Customers have found that Tlam SS 1KA reduces the stress on solder bonds with ceramic devices.

 

Standard constructions are made with 1 and 2 ounce copper and 0.040 (1 mm) and 0.062 (1.6 mm) inch thick aluminum. Custom constructions of heavier weight circuit copper and thicker aluminum and copper base plates are also available.

Typical value, for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. Peel strength is measured with 1oz Cu.

Specifications

Applications
• Network DC/DC power converters
• Battery powered equipment DC/DC power converters
• Ultra bright LED substrates
Capacitance
at 1 KHz 161
Comparative Tracking Index
600
Continuous AC
120
Continuous DC
225
CTE in XY/Z axis
, < Tg 32/43, > Tg Sep-19
Datasheet ID
THR-DS-Tlam-SS-1KA 1110
Dielectric Constant Range
1 kHz 4.3
Dielectric Strength
650 (25.6)
Dielectric Thickness
0.006 (0.152)
Dissipation Factor at 1KHz
0.008
Elongation at break
0.8 @25C 1.0 @150C
Flexural Strength (MPa)
49.7
Glass Transition Temperature (°C)
105
Peak Recurring
300
Peel Strength
4.5 (0.8)
Poisson’s Ratio @ 25/150°C
1 5/8
Product Title
Tlam SS 1KA
Solder Float (4 min. @ 288°C)
Pass
Soldering Temperature Maximum
288
Surface Resistivity
1.00E+10
Temperature - Operating (Max Celsius)
120
Tensile Strength
del 52.2
Thermal Conductivity (W/mK)
3
Thermal Resistance (°C-in²/W)
0.08 (0.52)
UL Continuous Operating Temperature (°C)
120
UL Flammability
94V0
Volume Resistivity
Volume Resistivity Del 1.2
Youngs Modulus
at 25/150C 3 16/27

Documentation